US 11,923,173 B2
Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
Teruo Yoshino, Toyama (JP); Naofumi Ohashi, Toyama (JP); and Tadashi Takasaki, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Nov. 28, 2022, as Appl. No. 17/994,763.
Application 17/994,763 is a continuation of application No. 17/692,722, filed on Mar. 11, 2022, granted, now 11,538,661.
Claims priority of application No. 2021-178348 (JP), filed on Oct. 29, 2021.
Prior Publication US 2023/0139945 A1, May 4, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/321 (2013.01) [H01J 37/32128 (2013.01); H01J 37/32183 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber comprising:
a plasma generation space capable of generating a plasma; and
a substrate processing space capable of processing a substrate;
a gas supplier capable of supplying a gas into the plasma generation space;
a first coil provided to surround the plasma generation space and configured to generate a first voltage distribution; and
a second coil provided to surround the plasma generation space and configured to generate a second voltage distribution such that a peak of the second voltage distribution does not overlap with a peak of the first voltage distribution.
 
18. A substrate processing method, comprising:
(a) generating a first voltage distribution by a first coil provided to surround a plasma generation space and generating a second voltage distribution by a second coil provided to surround the plasma generation space, wherein a peak of the second voltage distribution does not overlap with a peak of the first voltage distribution; and
(b) generating a plasma by supplying a gas into the plasma generation space of a process chamber provided with the plasma generation space and a substrate processing space, and processing a substrate accommodated in the substrate processing space.