US 11,923,151 B2
Structural lead frame
Galen W. Miller, Simpsonville, SC (US); John Bultitude, Simpsonville, SC (US); and Lonnie G. Jones, Simpsonville, SC (US)
Assigned to KEMET Electronics Corporation
Filed by KEMET Electronics Corporation, Simpsonville, SC (US)
Filed on Jan. 13, 2021, as Appl. No. 17/148,038.
Claims priority of provisional application 62/969,408, filed on Feb. 3, 2020.
Prior Publication US 2021/0241977 A1, Aug. 5, 2021
Int. Cl. H01G 4/38 (2006.01); H01G 2/04 (2006.01); H01G 2/08 (2006.01); H01G 2/10 (2006.01); H01G 4/30 (2006.01); H01G 13/00 (2013.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H01L 25/07 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01)
CPC H01G 4/38 (2013.01) [H01G 2/04 (2013.01); H01G 2/08 (2013.01); H01G 2/10 (2013.01); H01G 4/30 (2013.01); H01G 13/00 (2013.01); H05K 1/0272 (2013.01); H05K 1/145 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/328 (2013.01); H01L 25/072 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10424 (2013.01); H05K 2201/10545 (2013.01)] 45 Claims
OG exemplary drawing
 
1. An electronic component package comprising:
a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
a structural lead frame comprising multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination;
wherein said structural lead frame comprises a break away artifact and at least one break away feature between adjacent said leads for separating adjacent said electronic components into a first electrical component package and a second electrical component package; and
wherein at least two said electronic components are electrically connected in parallel.