US 11,923,144 B2
Multilayer ceramic electronic component
Hyun Kim, Suwon-si (KR); Dong Jun Jung, Suwon-si (KR); Dae Hee Lee, Suwon-si (KR); and Soo Jeong Jo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 6, 2022, as Appl. No. 17/714,719.
Claims priority of application No. 10-2021-0194290 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215631 A1, Jul. 6, 2023
Int. Cl. H01G 4/012 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 4/0085 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a body including dielectric layers as well as a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween and including a first metal; and
external electrodes disposed on external surfaces of the body including a second metal,
wherein at least some of the plurality of internal electrodes include a core-shell region including the first and second metals, and
wherein a core portion and a shell portion of the core-shell region include the second metal such that average contents of the second metal in the core portion and the shell portion are different from each other.