US 11,921,546 B2
Polyimide film and flexible display panel including the same
Jin Su Park, Daejeon (KR); Hye Ri Kim, Daejeon (KR); Jin Hyung Park, Daejeon (KR); and Yoo Seock Hwang, Daejeon (KR)
Assigned to SK Innovation Co., Ltd., Seoul (KR); and SK ie technology Co., Ltd., Seoul (KR)
Filed by SK Innovation Co., Ltd., Seoul (KR); and SK IE Technology Co., Ltd., Seoul (KR)
Filed on Apr. 29, 2021, as Appl. No. 17/244,033.
Claims priority of application No. 10-2020-0053212 (KR), filed on May 4, 2020.
Prior Publication US 2021/0341971 A1, Nov. 4, 2021
Int. Cl. G06F 1/16 (2006.01); B32B 27/28 (2006.01); C08G 73/14 (2006.01); G02B 1/04 (2006.01); G02B 1/14 (2015.01)
CPC G06F 1/1652 (2013.01) [B32B 27/281 (2013.01); C08G 73/14 (2013.01); G02B 1/04 (2013.01); G02B 1/14 (2015.01); B32B 2307/51 (2013.01); B32B 2457/206 (2013.01); B32B 2457/208 (2013.01); C09K 2323/03 (2020.08)] 12 Claims
 
1. A polyimide-based film of which a modulus measured according to ASTM D882 is 5 GPa or more and a rate of change of the modulus, after the polyimide-based film is maintained under a high-temperature and high-humidity condition of 60° C. and 90% RH for 500 hours, is 10% or less,
wherein the polyimide-based film has an elongation at break of 8% or more when measured according to ASTM D882, a light transmittance of 5% or more when measured at 388 nm according to ASTM D1746, a total light transmittance of 87% or more when measured at 400 to 700 nm according to ASTM D1746, a haze of 2.0% or less, a yellow index of 5.0 or less, and a b* value of 2.0 or less, and
wherein the polyimide-based film is formed from a polyamide-imide-based resin prepared by polymerizing an amine-terminated polyamide oligomer derived from a first fluorine-based aromatic diamine and an aromatic diacid dichloride, with a second fluorine-based aromatic diamine, an aromatic dianhydride, and an alicyclic dianhydride.