US 11,921,428 B2
Substrate processing method and substrate processing apparatus
Yoshihiro Uozumi, Aichi-ken (JP); Shinsuke Kimura, Mie-ken (JP); Yoshihiro Ogawa, Mie-ken (JP); Hiroyasu Iimori, Mie-ken (JP); Tatsuhiko Koide, Mie-ken (JP); Hideaki Hirabayashi, Kanagawa-ken (JP); and Yuji Nagashima, Kanagawa-ken (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by KIOXIA CORPORATION, Tokyo (JP)
Filed on Feb. 25, 2022, as Appl. No. 17/680,396.
Application 16/357,151 is a division of application No. 14/940,186, filed on Nov. 13, 2015, abandoned.
Application 14/940,186 is a division of application No. 13/541,167, filed on Jul. 3, 2012, granted, now 9,213,242, issued on Dec. 15, 2015.
Application 17/680,396 is a continuation of application No. 16/357,151, filed on Mar. 18, 2019, abandoned.
Claims priority of application No. 2011-149367 (JP), filed on Jul. 5, 2011.
Prior Publication US 2022/0181171 A1, Jun. 9, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/40 (2006.01); G03F 7/16 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01)
CPC G03F 7/405 (2013.01) [G03F 7/162 (2013.01); H01L 21/67017 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67075 (2013.01); H01L 21/67098 (2013.01); H01L 21/6715 (2013.01); H01L 21/67739 (2013.01); H01L 21/68 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate processing method by using a substrate processing apparatus provided with a holding unit and a processing unit, comprising:
treating at least a major surface side of a substrate with a first liquid, a structural body being provided on the major surface of the substrate, the structural body having a top surface, a side surface and a bottom surface, the bottom surface contacting the major surface of the substrate;
bringing a second liquid into contact with the structural body and the substrate, the second liquid being not a rinsing liquid;
forming a solid member by changing at least a portion of the second liquid into a solid, the solid member being formed to be in contact with at least the side surface of the structural body and to prevent the structural body from collapse when drying after the liquid treatment by the second liquid, the changing at least the portion of the second liquid into the solid including at least one of a pressure application process, a spin drying process, a gas supply drying process, or a natural drying process;
providing the substrate provided with the solid member on the holding unit;
blowing a gas onto the major surface of the substrate for heating the substrate by using a nozzle provided with the processing unit; and
removing the solid member from a solid phase directly to a gaseous phase, the solid member being removed using sublimation by heating,
wherein:
a plurality of the structural bodies are provided on the major surface of the substrate, and the solid member covers at least a portion of each of the structural bodies, and
the forming the solid member includes forming the solid member so that a space partially remains in the solid member between the structural bodies.