US 11,921,424 B2
Photosensitive resin composition, dry film using same, printed wiring board, and printed wiring board manufacturing method
Nobuhito Komuro, Tokyo (JP); Yuta Daijima, Tokyo (JP); Masayuki Kojima, Tokyo (JP); Shinji Irizawa, Tokyo (JP); and Shinya Oosaki, Tokyo (JP)
Assigned to Hitachi Chemical Company, Ltd. (FIPAS), Tokyo (JP)
Appl. No. 16/497,600
Filed by Hitachi Chemical Company, Ltd., Tokyo (JP)
PCT Filed Mar. 30, 2017, PCT No. PCT/JP2017/013342
§ 371(c)(1), (2) Date Sep. 25, 2019,
PCT Pub. No. WO2018/179259, PCT Pub. Date Oct. 4, 2018.
Prior Publication US 2021/0109444 A1, Apr. 15, 2021
Int. Cl. G03F 7/031 (2006.01); G03F 7/029 (2006.01); G03F 7/032 (2006.01); G03F 7/038 (2006.01); G03F 7/40 (2006.01); H05K 3/00 (2006.01)
CPC G03F 7/031 (2013.01) [G03F 7/029 (2013.01); G03F 7/032 (2013.01); G03F 7/0382 (2013.01); G03F 7/40 (2013.01); H05K 3/0076 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A photosensitive resin composition comprising:
an acid-modified vinyl group-containing epoxy resin (A);
a photopolymerization initiator (B);
a photopolymerization sensitizer containing a benzophenone compound (C); and
a photopolymerizable compound (D), wherein
the acid-modified vinyl group-containing epoxy resin (A) comprises at least one acid-modified vinyl group-containing epoxy resin (A1) synthesized using a bisphenol novolak type epoxy resin (a1) and at least one acid-modified vinyl group-containing epoxy resin (A2) synthesized using an epoxy resin (a2) different from the epoxy resin (a1), and
the acid-modified vinyl group-containing epoxy resin (A1) is a resin obtained by reacting a resin (A1′) obtained by reacting the epoxy resin (a1) with a vinyl group-containing monocarboxylic acid (b) with a saturated or unsaturated group-containing polybasic acid anhydride (c), and the acid-modified vinyl group-containing epoxy resin (A2) is a resin obtained by reacting a resin (A2′) obtained by reacting each of the epoxy resins (a2) with a vinyl group-containing monocarboxylic acid (b) with a saturated or unsaturated group-containing polybasic acid anhydride (c);
wherein the epoxy resin (a2) is at least one selected from the group consisting of a novolak type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a triphenolmethane type epoxy resin.