US 11,921,270 B2
Inspection system including reference specimen and method of forming semiconductor device
Sungil Choi, Hwaseong-si (KR); Yeeun Park, Hwaseong-si (KR); Kyungbeom Kim, Hwaseong-si (KR); Sungyoon Ryu, Seoul (KR); Jinwoo Ahn, Yongin-si (KR); and Sunhong Jun, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 23, 2021, as Appl. No. 17/561,276.
Claims priority of application No. 10-2021-0090224 (KR), filed on Jul. 9, 2021.
Prior Publication US 2023/0008686 A1, Jan. 12, 2023
Int. Cl. G02B 21/02 (2006.01); G01J 3/28 (2006.01); G02B 21/00 (2006.01); G02B 21/36 (2006.01)
CPC G02B 21/0004 (2013.01) [G01J 3/2823 (2013.01); G02B 21/02 (2013.01); G02B 21/36 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inspection system comprising:
a main support die configured to receive a target specimen;
an auxiliary support die adjacent to the main support die and configured to receive a reference specimen;
a cleaning device configured to remove contaminants from the reference specimen;
an objective lens unit configured to direct light to main support die from a light source adjacent to the objective lens unit;
a spectroscope between the objective lens unit and the light source;
a detector adjacent to the objective lens unit;
an imaging device between the objective lens unit and the detector; and
a computer system in communication with the detector.