US 11,921,131 B2
Method for manufacturing a measurement probe, and measurement probe
Alexander Kunze, Munich (DE); and Alexander Stuka, Hengersberg (DE)
Assigned to ROHDE & SCHWARZ GMBH & CO. KG, Munich (DE)
Filed by Rohde & Schwarz GmbH & Co. KG, Munich (DE)
Filed on Mar. 18, 2021, as Appl. No. 17/205,661.
Prior Publication US 2022/0299545 A1, Sep. 22, 2022
Int. Cl. G01R 1/067 (2006.01)
CPC G01R 1/06761 (2013.01) [G01R 1/06738 (2013.01)] 23 Claims
OG exemplary drawing
 
23. A method, comprising:
cutting a carrier substrate to form a probe contour, the probe contour comprising at least one probe tip and a probe body, wherein the carrier substrate comprises a conductive layer which is formed on the carrier substrate;
forming the at least one probe tip by cutting the carrier substrate to provide a respective protrusion in a predefined first plane that includes a plane of extension of the carrier substrate, wherein forming the at least one probe tip comprises at least one of laser cutting or milling a height profile comprising more than one height steps of the respective protrusion in the carrier substrate in a second plane that is orthogonal to the first plane;
metallizing a surface of the at least one probe tip of the probe contour such that a resulting metallization layer completely covers the probe tip, wherein the resulting metallization layer directly contacts an opposite side of the conductive layer of the probe tom; and
providing in an electrical connection of the at least one probe tip or between the electrical connection and the at least one probe tip a resistor with a predetermined resistance value between 50 kOhms and 500 kOhms, wherein the resistor is provided at a distance of 0.1 mm to 1.5 mm from a contacting end or edge of the respective probe tip.