US 11,921,054 B2
Cleaved semiconductor wafer camera system
Benjamin Michael Meyer, Defiance, MO (US); Justin Scott Kayser, Wentzville, MO (US); John F. Valley, Lake Oswego, OR (US); James Dean Eoff, Montgomery, MO (US); Vandan Tanna, O'Fallon, MO (US); and William L. Luter, St. Charles, MO (US)
Assigned to GlobalWafers Co., Ltd., Hsinchu (TW)
Filed by GlobalWafers Co., Ltd., Hsinchu (TW)
Filed on Sep. 13, 2021, as Appl. No. 17/447,519.
Claims priority of provisional application 62/706,895, filed on Sep. 16, 2020.
Claims priority of provisional application 62/706,897, filed on Sep. 16, 2020.
Claims priority of provisional application 62/706,894, filed on Sep. 16, 2020.
Prior Publication US 2022/0082510 A1, Mar. 17, 2022
Int. Cl. G01N 21/95 (2006.01); G06T 7/00 (2017.01); G06T 7/12 (2017.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01); H04N 23/56 (2023.01); G01N 21/88 (2006.01)
CPC G01N 21/9503 (2013.01) [G06T 7/0004 (2013.01); G06T 7/12 (2017.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H04N 23/56 (2023.01); G01N 2021/8812 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/20056 (2013.01); G06T 2207/30148 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor wafer imaging system for imaging a semiconductor wafer, the system comprising:
shroud panels defining a black box;
a camera positioned in the black box for imaging the semiconductor wafer;
an illumination panel for directing diffuse light to the semiconductor wafer, wherein a portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light; and
a flat mirror to reflect the diffuse light to the camera.