	US 11,920,255 B2
	Composite plated product and method for producing same
Hirotaka Kotani, Tokyo (JP); Yukiya Kato, Tokyo (JP); Tatsuhiro Doi, Tokyo (JP); Takao Tomiya, Tokyo (JP); and Hiroto Narieda, Tokyo (JP)
Assigned to Dowa Metaltech Co., Ltd., Tokyo (JP)
Appl. No. 17/630,564
Filed by Dowa Metaltech Co., Ltd., Tokyo (JP)
PCT Filed Jun. 4, 2020, PCT No. PCT/JP2020/022071 § 371(c)(1), (2) Date Jan. 27, 2022, PCT Pub. No. WO2021/019907, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-141916 (JP), filed on Aug. 1, 2019.
Prior Publication US 2022/0259753 A1, Aug. 18, 2022
Int. Cl. C25D 3/46 (2006.01); C25D 5/48 (2006.01); C25D 7/00 (2006.01); H01H 1/023 (2006.01); H01H 1/027 (2006.01); H01R 13/03 (2006.01)

CPC C25D 3/46 (2013.01) [C25D 5/48 (2013.01); C25D 7/00 (2013.01); H01H 1/023 (2013.01); H01H 1/027 (2013.01); H01R 13/03 (2013.01); Y10T 428/12625 (2015.01)]

9 Claims

1. A composite plated product comprising:

a base material; and

a composite plating film of a composite material which contains carbon particles in a silver layer, the composite plating film being formed on the base material,

wherein the percentage of an area occupied by the carbon particles on the surface of the composite plating film is in the range of from 1 area % to 50 area %, and

wherein the number of the carbon particles adhered to an adhesive tape having an adhesive force of 4.02 N/10 mm is not larger than 35,000/mm²when the adhesive tape is peeled off from the surface of the composite plating film after it is put thereon.