	US 11,920,023 B2
	Composite materials for dielectric applications
Colin Hayes, Hudson, MA (US); Colin Calabrese, Marlborough, MA (US); and Christine Hatter, Waltham, MA (US)
Assigned to Rohm and Haas Electronic Materials LLC., Marlborough, MA (US)
Filed by Rohm and Haas Electronic Materials LLC, Marlborough, MA (US)
Filed on Apr. 28, 2022, as Appl. No. 17/731,690.
Prior Publication US 2023/0348706 A1, Nov. 2, 2023
Int. Cl. C08F 212/32 (2006.01); C08F 212/12 (2006.01); C08F 226/06 (2006.01); C08F 228/06 (2006.01); C08L 25/02 (2006.01); C08L 43/04 (2006.01)

CPC C08L 25/02 (2013.01) [C08L 43/04 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2312/00 (2013.01)]

12 Claims

1. A dielectric composite material comprising:

(a) 20-50 weight % total solids of at least one thermosetting resin and other resin components; and

(b) 50-72 weight % total solids of at least one inorganic particulate filler;

where:

the at least one inorganic particulate filler is surface modified with one or more acrylic-based silane coupling agents; and

wherein the one or more acrylic-based silane coupling agents is combined with one or more polymeric silanes.