US 11,920,019 B2
Resin composition and electronic device
Tomomi Sugai, Hino (JP); Shinya Otsu, Koganei (JP); Hiroshi Nishimura, Hachioji (JP); and Kunio Tani, Hachioji (JP)
Assigned to KONICA MINOLTA, INC., Tokyo (JP)
Appl. No. 17/278,033
Filed by Konica Minolta, Inc., Tokyo (JP)
PCT Filed Oct. 2, 2019, PCT No. PCT/JP2019/038882
§ 371(c)(1), (2) Date Mar. 19, 2021,
PCT Pub. No. WO2020/071415, PCT Pub. Date Apr. 9, 2020.
Claims priority of application No. 2018-187968 (JP), filed on Oct. 3, 2018; application No. 2019-016036 (JP), filed on Jan. 31, 2019; and application No. 2019-117543 (JP), filed on Jun. 25, 2019.
Prior Publication US 2021/0347964 A1, Nov. 11, 2021
Int. Cl. C08K 5/34 (2006.01); C08L 101/00 (2006.01); H01L 29/786 (2006.01)
CPC C08K 5/34 (2013.01) [C08L 101/00 (2013.01); C08L 2203/20 (2013.01); H01L 29/786 (2013.01)] 3 Claims
 
1. An electronic device comprising a resin layer, a compound layer, and a metallic conductive layer, wherein
the compound layer comprises a compound having a structure represented by the following general formula (6):

OG Complex Work Unit Chemistry
wherein, in the general formula (6), X1 to X6 each represent —N═, —NH—, or —CR1—; R1 represents a hydrogen atom, an aryl group, a heteroaryl group, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a cyano group, a silyl group, a thiol group, a carbonyl group, a halogen atom, a trifluoromethyl group, or a hydroxy group, and optionally further has a substituent; and A1 and A2 form a heteroaryl ring,
the metallic conductive layer, the compound layer, and the resin layer are laminated in this order, and
the compound layer is formed only between the metallic conductive layer and the resin layer.