US 11,919,251 B2
Adhesive member, adhesion method, and method for manufacturing electronic device casing
Nobuo Yokomura, Tokyo (JP); Koji Kamiyama, Tokyo (JP); Atsuki Watai, Tokyo (JP); and Kentaro Nagata, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 17/762,731
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Nov. 15, 2019, PCT No. PCT/JP2019/044824
§ 371(c)(1), (2) Date Mar. 23, 2022,
PCT Pub. No. WO2021/095224, PCT Pub. Date May 20, 2021.
Prior Publication US 2022/0339886 A1, Oct. 27, 2022
Int. Cl. B29C 65/50 (2006.01); B29C 65/56 (2006.01); B29K 105/00 (2006.01); B29K 105/04 (2006.01); B29L 31/34 (2006.01)
CPC B29C 65/5057 (2013.01) [B29C 65/561 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/046 (2013.01); B29L 2031/3481 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An adhesive member, comprising:
a first pin portion to be inserted into a first hole formed in a first adherend member;
a second pin portion which is to be inserted into a second hole formed in a second adherend member to be adhered to the first adherend member, and is formed coaxially with the first pin portion; and
a flange portion all of which is formed using an adhesive, and is mounted to a side surface of the first pin portion or a side surface of the second pin portion in a flange shape.