US 11,919,123 B2
Apparatus and method for CMP temperature control
Surajit Kumar, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); Hui Chen, San Jose, CA (US); and Shou-Sung Chang, Mountain View, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 29, 2021, as Appl. No. 17/362,802.
Claims priority of provisional application 63/046,411, filed on Jun. 30, 2020.
Prior Publication US 2021/0402555 A1, Dec. 30, 2021
Int. Cl. B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 37/26 (2012.01); B24B 41/047 (2006.01)
CPC B24B 37/015 (2013.01) [B24B 37/107 (2013.01); B24B 37/26 (2013.01); B24B 41/047 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing apparatus comprising:
a rotatable platen to hold a polishing pad;
a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process; and
a temperature control system including a source of heated fluid and an arm extending over the platen, the arm having a base plate forming a bottom of the arm, wherein a plurality of openings having predetermined fixed sizes extend from a common plenum in the arm through the base plate, wherein the common plenum is coupled to the source of heated fluid, wherein the arm is located such that the openings are positioned over the platen and separated from the polishing pad by a gap to deliver the heated fluid from the common plenum onto the polishing pad, and wherein at least some of the openings are each differently sized so as to deliver a different amount of the fluid onto the polishing pad.