US 11,919,122 B2
Polishing head, substrate processing apparatus including the same and processing method of substrate using the same
Seung Bae Kang, Suwon-si (KR); Sung Hyeon Park, Anseong-si (KR); Jung Gun Nam, Suwon-si (KR); Joon-Hwa Bae, Suwon-si (KR); Kyung Bo Lee, Anseong-si (KR); Keun Woo Lee, Anseong-si (KR); Woo Jin Cho, Yongin-si (KR); and Byoung Kwon Choo, Hwaseong-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR); and KCTECH CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR); and KCTECH CO., LTD., Anseong-si (KR)
Filed on Sep. 29, 2020, as Appl. No. 17/036,062.
Claims priority of application No. 10-2019-0131321 (KR), filed on Oct. 22, 2019.
Prior Publication US 2021/0114163 A1, Apr. 22, 2021
Int. Cl. B24B 37/015 (2012.01); B24B 37/04 (2012.01); C03C 19/00 (2006.01); H01L 27/12 (2006.01); H01L 29/66 (2006.01); H10K 59/121 (2023.01); H10K 71/00 (2023.01); H10K 71/20 (2023.01); H10K 71/70 (2023.01); H10K 77/10 (2023.01); H01L 29/768 (2006.01); H01L 29/786 (2006.01); H10K 59/12 (2023.01)
CPC B24B 37/015 (2013.01) [B24B 37/042 (2013.01); C03C 19/00 (2013.01); H10K 59/1213 (2023.02); H10K 71/00 (2023.02); H10K 71/20 (2023.02); H10K 71/70 (2023.02); H10K 77/10 (2023.02); H01L 27/1218 (2013.01); H01L 27/1222 (2013.01); H01L 27/1262 (2013.01); H01L 27/1274 (2013.01); H01L 29/6675 (2013.01); H01L 29/78672 (2013.01); H10K 59/1201 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a conveyor belt on which a substrate is seated;
a polishing head which is connected to a driver and configured to face the substrate; and
in order between the substrate and the polishing head which faces the substrate:
a polishing pad having a temperature; and
a polishing pad fixing member which fixes the polishing head and the polishing pad to each other, directly receives heat from the polishing pad and has a temperature, the polishing pad fixing member extended in a plane between the polishing head and the polishing pad;
and
a temperature sensor which is adjacent to and spaced apart from the polishing pad fixing member, in the plane, the temperature sensor sensing the temperature of the polishing pad fixing member,
wherein the temperature of the polishing pad is defined by the sensed temperature of the polishing pad fixing member.