| CPC H10N 30/088 (2023.02) [H10N 30/05 (2023.02)] | 10 Claims |
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1. A method for manufacturing a plurality of vibration devices, the method comprising:
preparing a base wafer having a first surface and a second surface outwardly opposite to each other and including a first plurality of fragmentation regions therein, a first boundary being located between adjacent fragmentation regions of the first plurality of fragmentation regions;
placing a vibration element at the first surface of the base wafer for each of the first plurality of fragmentation regions;
bonding a lid wafer to the first surface of the base wafer via a plurality of metal layers, the lid wafer having a second plurality of fragmentation regions corresponding to the first plurality of fragmentation regions, respectively, each of the second plurality of fragmentation regions having a recess housing the vibration element therein, a second boundary being located between adjacent fragmentation regions of the second plurality of fragmentation regions, the first boundary aligning with the second boundary, each of the plurality of metal layers surrounding the vibration element in a plan view, a gap being provided between adjacent metal layers of the plurality of metal layers and between ends of the first and second boundaries;
forming a first groove in the first and second boundaries, the first groove completely extending through the second boundary of the lid wafer and extending through at least a portion of the first boundary of the base wafer;
placing a resin material in the first groove so that the resin material being filled in the gap and the first groove; and
forming a second groove along the first and second boundaries to produce the plurality of vibration devices, the second groove having a width smaller than a width of the first groove.
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