US 12,245,440 B2
Semiconductor device
Ki Hwan Kim, Seoul (KR); Jeong Ho Yoo, Seongnam-si (KR); Cho Eun Lee, Pocheon-si (KR); Yong Uk Jeon, Hwaseong-si (KR); and Young Dae Cho, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 11, 2022, as Appl. No. 17/692,369.
Claims priority of application No. 10-2021-0104357 (KR), filed on Aug. 9, 2021.
Prior Publication US 2023/0037672 A1, Feb. 9, 2023
Int. Cl. H01L 29/786 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H10D 30/67 (2025.01); H10D 64/01 (2025.01)
CPC H10D 30/6713 (2025.01) [H10D 30/6729 (2025.01); H10D 64/018 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an active pattern including a lower pattern and sheet patterns, the sheet patterns being spaced apart from the lower pattern in a first direction;
a source/drain pattern on the lower pattern, the source/drain pattern being in contact with the sheet patterns; and
gate structures on opposite sides of the source/drain pattern, the gate structures being spaced apart from each other along a second direction and including gate electrodes that surround the sheet patterns,
wherein the source/drain pattern includes:
a first epitaxial region including first impurities, which include at least one of antimony and bismuth, the first epitaxial region having a bottom part in contact with the lower pattern, but not with the sheet patterns, and with respect to the second direction away from the gate structures, a thickness of the bottom part increases and then decreases, and
a second epitaxial region on the first epitaxial region, the second epitaxial region including second impurities, which include phosphorus.