US 12,245,408 B2
Motor controller heat dissipating systems and methods
Adam Christopher Bender, Mountain View, CA (US); Nikola Popov, Burlingame, CA (US); and Chen-Yu Lin, Santa Clara, CA (US)
Assigned to Lyft, Inc., San Francisco, CA (US)
Filed by Lyft, Inc., San Francisco, CA (US)
Filed on Mar. 20, 2020, as Appl. No. 16/825,821.
Prior Publication US 2021/0296202 A1, Sep. 23, 2021
Int. Cl. H05K 7/20 (2006.01); B60W 10/08 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/209 (2013.01) [H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H05K 1/021 (2013.01); B60W 10/08 (2013.01); H05K 1/0204 (2013.01); H05K 7/20454 (2013.01); H05K 7/205 (2013.01); H05K 2201/066 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10666 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micromobility transit vehicle comprising:
a motor controller comprising:
a printed circuit board (PCB) having an aperture defined by a metal ring;
a metal-oxide-semiconductor field-effect transistor (MOSFET) attached to the PCB above the aperture of the PCB;
a heat transfer plug having a first portion positioned on a side of the PCB opposite of the MOSFET and a second portion positioned at least partially within the aperture of the PCB to contact the MOSFET, wherein heat dissipates from the MOSFET to the heat transfer plug through direct contact of the heat transfer plug with the MOSFET, wherein the first portion of the heat transfer plug (1) at least partially contacts the metal ring and (2) does not contact the PCB, and wherein the second portion of the heat transfer plug has a diameter such that an air gap is formed between the second portion and the metal ring when the second portion is within the aperture;
a heat sink; and
a thermal interface material (TIM) positioned between the heat transfer plug and the heat sink, wherein the TIM is configured to dissipate heat from the heat transfer plug to the heat sink.