US 12,245,403 B2
Heat dissipation cabinet and communication device
Zhisheng Lian, Dongguan (CN); Tao Feng, Shenzhen (CN); and Shulong Xu, Dongguan (CN)
Assigned to Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed by HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Nov. 4, 2022, as Appl. No. 17/981,129.
Application 17/981,129 is a continuation of application No. PCT/CN2020/088796, filed on May 6, 2020.
Prior Publication US 2023/0057893 A1, Feb. 23, 2023
Int. Cl. H05K 7/20 (2006.01); H05K 5/02 (2006.01)
CPC H05K 7/20581 (2013.01) [H05K 5/0214 (2022.08); H05K 5/0217 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A heat dissipation cabinet, comprising:
a cabinet body, a cabinet door, and a baffle, wherein:
the cabinet body comprises a top wall and a bottom wall that are oppositely disposed, and a side wall connected between the top wall and the bottom wall, the cabinet door is installed at a position of the side wall in the cabinet body, and an air outlet passage is disposed in the cabinet body that is close to a position of the top wall;
an air inlet component and an air outlet component are disposed in the cabinet door, and the air outlet component is located between the air inlet component and the top wall, and is located at one end of the air outlet passage;
an electronic apparatus placement area is disposed in the cabinet body, and the baffle is disposed between the electronic apparatus placement area and the cabinet door;
the air outlet passage comprises a body and an air duct that penetrates the body, wherein two opposite ends of the body comprise a second opening and a third opening that communicate with the air duct, the second opening communicates with the air outlet component, and the third opening is located above the electronic apparatus placement area; and
the baffle comprises a first opening, wherein air that enters through the air inlet component directly enters the electronic apparatus placement area through the first opening.