US 12,245,396 B2
Integration of active MEMS cooling systems into thin computing devices
Prabhu Sathyamurthy, San Jose, CA (US); Suryaprakash Ganti, Los Altos, CA (US); Seshagiri Rao Madhavapeddy, La Jolla, CA (US); Nilesh Sudhir Hasabnis, Fremont, CA (US); Vikram Mukundan, San Ramon, CA (US); and William Finn Ninian Paisley, Los Altos Hills, CA (US)
Assigned to Frore Systems Inc., San Jose, CA (US)
Filed by Frore Systems Inc., San Jose, CA (US)
Filed on Nov. 29, 2023, as Appl. No. 18/523,790.
Claims priority of provisional application 63/547,653, filed on Nov. 7, 2023.
Claims priority of provisional application 63/429,133, filed on Nov. 30, 2022.
Prior Publication US 2024/0179868 A1, May 30, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20172 (2013.01) [G06F 1/20 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20436 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A cooling system in a computing device, comprising:
a heat transfer structure including:
a heat spreader;
a fin structure that transfers heat from the heat spreader to a fluid; and
a differential pressure device that generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure, from the fin structure to at least one vent of the differential pressure device, and out at least one orifice of the differential pressure device;
wherein the heat transfer structure is enclosed in a chamber of the computing device, the chamber having the ingress and an egress, the fin structure residing in a fluid path between the ingress and the differential pressure device.
 
11. A cooling system in a computing device, comprising:
a heat transfer structure including:
a heat spreader;
a differential pressure device that generates a low pressure region that draws fluid from an ingress in the computing device through the heat transfer structure, the differential pressure device having a height not exceeding 3.5 millimeters; and
a fin structure that transfers heat from the heat spreader to the fluid, the fin structure being in a fluid path between the ingress and the differential pressure device, the low pressure region generated by the differential pressure device drawing the fluid through the fin structure, from the fin structure to at least one vent of the differential pressure device, and out at least one orifice of the differential pressure device.
 
18. A method, comprising:
activating an active component in a differential pressure device to undergo vibrational motion, a computing device including a heat transfer structure, the heat transfer structure including the differential pressure device, a fin structure, and a heat spreader, the fin structure transferring heat from the heat spreader to a fluid, the vibrational motion of the active component generating a low pressure region that draws the fluid from an ingress in the computing device through the fin structure, from the fin structure to at least one vent of the differential pressure device, and out at least one orifice of the differential pressure device, the heat transfer structure being enclosed in a chamber of the computing device, the chamber having the ingress and an egress, the fin structure residing in a fluid path between the ingress and the differential pressure device.