US 12,245,395 B2
Techniques for small form factor device cooling
Charles Abdouch, Round Rock, TX (US); and Joseph Giannuzzi, Cedar Park, TX (US)
Assigned to SIMPLY NUC, INC., Round Rock, TX (US)
Filed by SIMPLY NUC, INC., Round Rock, TX (US)
Filed on Sep. 26, 2023, as Appl. No. 18/474,950.
Claims priority of provisional application 63/410,020, filed on Sep. 26, 2022.
Prior Publication US 2024/0107701 A1, Mar. 28, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20145 (2013.01) [G06F 1/20 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01); H05K 7/20209 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a carrier plate;
a housing unit mounted to the carrier plate;
a fan located within the housing unit; a plurality of inlets on the housing unit for directing air to the fan; and an exhaust port for directing air away from the fan,
wherein the carrier plate is formed of a thermally-conductive material configured to contact and draw heat away from a component device via the fan, the carrier plate comprising a protrusion that has a shape and size that corresponds to a shape and size of a surface of the component device and is located below the fan and adjacent to an opening that allows air flow through the carrier plate and into the fan, wherein the apparatus is configured to be installed in an expansion port of a computing device, and
wherein the carrier plate comprises a second expansion port for connecting an additional component device to the computing device.