US 12,245,392 B2
Cover laminated with multilayer film, electronic device including the same, and method for manufacturing multilayer film
Jeamoon Jung, Suwon-si (KR); Jayeun Ko, Suwon-si (KR); Hokyung Moon, Suwon-si (KR); and Taehyun Song, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 23, 2022, as Appl. No. 17/678,915.
Application 17/678,915 is a continuation of application No. PCT/KR2022/001230, filed on Jan. 24, 2022.
Claims priority of application No. 10-2021-0024198 (KR), filed on Feb. 23, 2021.
Prior Publication US 2022/0272856 A1, Aug. 25, 2022
Int. Cl. H05K 5/03 (2006.01); B32B 15/08 (2006.01); B32B 15/10 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); C08J 7/04 (2020.01); H04M 1/02 (2006.01)
CPC H05K 5/03 (2013.01) 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a cover forming a portion of an exterior of the electronic device;
a film layer attached to a first surface of the cover;
at least one ultraviolet (UV) molding pattern layer disposed on the film layer, wherein the at least one UV molding pattern layer includes a first area, and a second area that is different from the first area;
a thermally cured printing layer disposed on the at least one UV molding pattern layer in the first area; and
a deposition layer including:
a first part disposed to overlap the first area of the at least one UV molding pattern layer, and
a second part interfaced with the at least one UV molding pattern layer including a pattern in the second area.