US 12,245,382 B2
Three-dimensional patterned module exterior surface for improved heat dissipation and method of fabricating
Loizos Loizou, Grasbrunn (DE); Tobias Mangold, Huglfing (DE); and Andreas Link, Laaber (DE)
Assigned to Qorvo US, Inc., Greensboro, NC (US)
Filed by Qorvo US, Inc., Greensboro, NC (US)
Filed on Nov. 18, 2022, as Appl. No. 17/989,954.
Claims priority of provisional application 63/285,214, filed on Dec. 2, 2021.
Prior Publication US 2023/0180393 A1, Jun. 8, 2023
Int. Cl. H05K 3/28 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC H05K 3/284 (2013.01) [H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10431 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A module comprising:
a laminate;
at least one circuit component disposed on the laminate;
an overmold disposed on the at least one circuit component,
wherein:
an exterior surface of the overmold comprises a three-dimensional (3D) pattern; and
a protective shield comprising an electrically conductive material configured to reduce electromagnetic interference from the at least one circuit disposed on the overmold.