US 12,245,376 B2
Embedded printed circuit board
Seiji Sato, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Dec. 6, 2022, as Appl. No. 18/062,229.
Claims priority of application No. 2021-206374 (JP), filed on Dec. 20, 2021.
Prior Publication US 2023/0199967 A1, Jun. 22, 2023
Int. Cl. H05K 1/18 (2006.01)
CPC H05K 1/185 (2013.01) [H05K 2201/0212 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10977 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An embedded printed circuit board comprising:
a first substrate;
a semiconductor chip mounted on the first substrate;
a second substrate provided on the first substrate via the semiconductor chip so that the semiconductor chip is sandwiched between the first substrate and the second substrate;
a first resin filled between the semiconductor chip and the first substrate and having a cladding portion covering a side surface of the semiconductor chip; and
a second resin filled between the first substrate and the second substrate and encapsulating the semiconductor chip and the first resin, such that the second resin makes contact with a back surface of the semiconductor chip facing the second substrate and a lower surface of the second substrate facing the semiconductor chip, wherein:
the first resin includes a protrusion protruding from the cladding portion toward the second substrate, and
the protrusion has a top portion located closer to the lower surface of the second substrate than to the back surface of the semiconductor chip.