| CPC H05K 1/116 (2013.01) [H05K 2201/042 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/10378 (2013.01)] | 17 Claims |
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1. An electronic device comprising:
a housing;
a first substrate disposed in the housing and comprising a plurality of first conductive terminals;
a second substrate disposed in the housing and comprising a plurality of second conductive terminals; and
an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate,
wherein the interposer comprises:
a dielectric substrate comprising a plurality of insulating layers, a first surface facing the first substrate, a second surface facing the second substrate, and a side surface surrounding a space between the first surface and the second surface;
a plurality of first conductive pads disposed on a first insulating layer, in the space between the first surface and the second surface, among the plurality of insulating layers;
a plurality of second conductive pads disposed on a second insulating layer, in the space between the first surface and the second surface, among the plurality of insulating layers;
a plurality of conductive posts configured to electrically connect the plurality of first conductive pads to the plurality of second conductive pads;
a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV); and
a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.
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