US 12,245,373 B2
Printed circuit board and electronic device including same
Ping-Han Tsou, Taipei (TW); and Li-Chien Wan, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTEK COMPUTER INC., Taipei (TW)
Filed on Feb. 3, 2022, as Appl. No. 17/592,126.
Claims priority of application No. 110128044 (TW), filed on Jul. 30, 2021.
Prior Publication US 2023/0031184 A1, Feb. 2, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/092 (2013.01) [H05K 1/0201 (2013.01); H05K 1/111 (2013.01); H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H05K 2201/0323 (2013.01)] 9 Claims
OG exemplary drawing
 
6. An electronic device, comprising:
a printed circuit board, comprising:
a substrate, comprising a first surface;
an electrically conductive pattern layer, located on the first surface and comprising a contact portion and a wire portion; and
a thermally conductive ink layer, covering the wire portion and exposing the contact portion, wherein the thermally conductive ink layer comprises a thermally conductive powder and a colloidal adhesive, a weight percentage of the thermally conductive powder is less than 10%, and a weight percentage of the colloidal adhesive is higher than 80%;
an electronic element, disposed on the thermally conductive ink layer and connected to the contact portion; and
a thermally conductive material layer, covering the electronic element and extending to come into contact with the thermally conductive ink layer,
wherein the thermal conductive ink layer is used as a solder mask;
wherein the thermally conductive ink layer comprises dispersant;
wherein an exposed surface of the contact portion is aligned with an upper surface of the thermal conductive ink layer.