US 12,245,370 B2
Printed circuit board
Seung Hyun Noh, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jul. 11, 2022, as Appl. No. 17/861,484.
Claims priority of application No. 10-2021-0185229 (KR), filed on Dec. 22, 2021.
Prior Publication US 2023/0199946 A1, Jun. 22, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
an insulating layer;
a conductive pattern disposed within the insulating layer;
a skin layer disposed on the insulating layer and having an opening on the conductive pattern; and
gold (Au) contained in a connection layer disposed in the opening to connect to a portion of the conductive pattern and at least partially surrounded by the skin layer.