US 12,245,367 B2
Head wearable electronic device and method for manufacturing the same
Haesun Lee, Seoul (KR); Hyeongseok Chae, Seoul (KR); and Induck Hwang, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 16/488,930
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Aug. 5, 2019, PCT No. PCT/KR2019/009715
§ 371(c)(1), (2) Date Jul. 22, 2021,
PCT Pub. No. WO2021/025190, PCT Pub. Date Feb. 11, 2021.
Prior Publication US 2021/0360778 A1, Nov. 18, 2021
Int. Cl. H05K 1/02 (2006.01); G02B 27/01 (2006.01); G06F 3/01 (2006.01)
CPC H05K 1/0274 (2013.01) [G02B 27/0172 (2013.01); G06F 3/011 (2013.01); G02B 2027/0141 (2013.01); H05K 2201/10151 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a cover allowing an external signal to pass therethrough;
a circuit board provided on one side of the cover and having a first opening allowing the external signal to pass therethrough;
a sensing unit provided on one side of the circuit board and having a sensor part provided at a position corresponding to the first opening to receive the external signal; and
a blocking member including a second opening formed at a position corresponding to the first opening to allow the external signal to pass therethrough,
wherein the cover is formed of a light-transmissive resin,
wherein the blocking member is formed of a non-transmissive resin and is formed as a single layer,
wherein the blocking member is integrally formed with the cover,
wherein the cover, the blocking member and the circuit board are each formed in a form of a flat plate, and
wherein the blocking member is thinner than the circuit board.