US 12,245,366 B2
Wiring board
Hidetoshi Yugawa, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto (JP)
Appl. No. 17/771,640
Filed by Kyocera Corporation, Kyoto (JP)
PCT Filed Aug. 21, 2020, PCT No. PCT/JP2020/031575
§ 371(c)(1), (2) Date Apr. 25, 2022,
PCT Pub. No. WO2021/084860, PCT Pub. Date May 6, 2021.
Claims priority of application No. 2019-197805 (JP), filed on Oct. 30, 2019.
Prior Publication US 2022/0418098 A1, Dec. 29, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0271 (2013.01) [H05K 1/09 (2013.01); H05K 1/116 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 3/0035 (2013.01); H05K 3/389 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09509 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A wiring board, comprising:
a first insulating layer and a second insulating layer;
a first wiring conductor layer located between the first insulating layer and the second insulating layer and comprising a first via land;
a second wiring conductor layer located on the second insulating layer and comprising a second via land;
a via hole penetrating from an upper surface to a lower surface of the second insulating layer; and
a via conductor located in the via hole and electrically connecting the first via land and the second via land,
wherein
the via conductor is located on an inner surface of the via hole and on the first via land via a first base layer containing nichrome and a second base layer located on an upper surface of the first base layer and containing the same metal as a metal forming the via conductor, and
an alloy layer containing the same metal as a metal forming the first wiring conductor layer, tin, and nichrome is located between the first via land and the first base layer.