US 12,245,365 B2
High-frequency electronic component and module
Hirofumi Oie, Kyoto (JP); and Ikuo Deguchi, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 24, 2023, as Appl. No. 18/174,201.
Application 18/174,201 is a continuation of application No. PCT/JP2021/023888, filed on Jun. 24, 2021.
Claims priority of application No. 2020-142402 (JP), filed on Aug. 26, 2020.
Prior Publication US 2023/0225045 A1, Jul. 13, 2023
Int. Cl. H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/024 (2013.01) [H05K 1/023 (2013.01); H05K 1/0306 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A high-frequency electronic component comprising:
a ceramic multilayer substrate;
ground electrodes provided at different layers of the ceramic multilayer substrate; and
a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate,
two or more of the ground electrodes being exposed to the side surface of the ceramic multilayer substrate and being electrically connected to the shielding film,
on the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes not overlapping each other in a thickness direction of the ceramic multilayer substrate.