US 12,245,364 B2
Wiring board and electronic device
Tatsuaki Denda, Nagano (JP); and Takehito Terasawa, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Nov. 22, 2022, as Appl. No. 17/992,078.
Claims priority of application No. 2021-190262 (JP), filed on Nov. 24, 2021.
Prior Publication US 2023/0164908 A1, May 25, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/0224 (2013.01) [H05K 1/0393 (2013.01); H05K 2201/2081 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a plurality of insulating layers each being made of flexible insulating resin; and
a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern, wherein
the conductor pattern has a certain shape in which a plurality of unit patterns are connected in plan view,
each of the unit patterns includes
a U-shaped pattern;
an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern; and
a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern, and
in the certain shape of the conductor pattern, one end of the U-shaped pattern of a first unit pattern is connected to one end of the inverted U-shaped pattern of a second unit pattern, another end of the U-shaped pattern of the first unit pattern is connected to one end of the inverted U-shaped pattern of a third unit pattern, one end of the inverted U-shaped pattern of a fourth unit pattern is connected to one end of the U-shaped pattern of the second unit pattern, and another end of the inverted U-shaped pattern of the fourth unit pattern is connected to one end of the U-shaped pattern of the third unit pattern.