US 12,245,361 B2
Interconnect structure having conductor extending along dielectric block
Jiun-Yi Wu, Taoyuan (TW); Chien-Hsun Lee, Hsinchu County (TW); Chewn-Pu Jou, Hsinchu (TW); and Fu-Lung Hsueh, Kaohsiung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jun. 29, 2023, as Appl. No. 18/344,652.
Application 15/723,099 is a division of application No. 15/016,147, filed on Feb. 4, 2016, granted, now 9,807,867, issued on Oct. 31, 2017.
Application 18/344,652 is a continuation of application No. 17/884,418, filed on Aug. 9, 2022, granted, now 11,737,205.
Application 17/884,418 is a continuation of application No. 17/025,887, filed on Sep. 18, 2020, granted, now 11,457,525, issued on Sep. 27, 2022.
Application 17/025,887 is a continuation of application No. 15/723,099, filed on Oct. 2, 2017, granted, now 10,785,865, issued on Sep. 22, 2020.
Prior Publication US 2023/0354503 A1, Nov. 2, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/0216 (2013.01) [H01L 21/485 (2013.01); H01L 21/486 (2013.01); H01L 21/76805 (2013.01); H01L 23/49827 (2013.01); H01L 23/552 (2013.01); H05K 1/0222 (2013.01); H05K 1/024 (2013.01); H05K 1/113 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/4007 (2013.01); H05K 3/423 (2013.01); H05K 1/0245 (2013.01); H05K 3/4038 (2013.01); H05K 3/42 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09645 (2013.01); Y10T 29/49165 (2015.01)] 20 Claims
OG exemplary drawing
 
1. An interconnect structure comprising:
a dielectric block;
a first conductive plug and a second conductive plug surrounded by the dielectric block;
a substrate surrounding the dielectric block;
a first conductive line connected to the first conductive plug and in contact with a top surface of the dielectric block;
a second conductive line connected to the second conductive plug; and
a first conductor within the dielectric block, wherein the first conductor laterally surrounds the first conductive plug and is interposed between the dielectric block and the first conductive plug, and the first conductor is formed of a different material than the first conductive plug.