US 12,245,360 B2
Power arrangement and cooling system for electronic devices
David Mohr, Houston, TX (US); Tahir Cader, Spokane Valley, WA (US); Elad Mentovich, Tel Aviv (IL); Boaz Atias, Ma'ale Adumim (IL); and Chong Tan, The Woodlands, TX (US)
Assigned to NVIDIA Corporation, Santa Clara, CA (US)
Filed by NVIDIA Corporation, Santa Clara, CA (US)
Filed on Aug. 2, 2022, as Appl. No. 17/879,620.
Prior Publication US 2024/0049380 A1, Feb. 8, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 7/20154 (2013.01); H05K 7/209 (2013.01); H05K 7/20909 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) assembly, comprising:
a PCB comprising a first side and a second side, wherein the first side of the PCB is offset from the second side of the PCB by a thickness of the PCB;
at least one processing circuit operatively connected to the PCB adjacent the first side of the PCB, wherein the at least one processing circuit comprises an electronic device that generates heat, and wherein the first side of the PCB is free of any power converter;
a power converter operatively connected to the PCB adjacent the second side of the PCB, wherein the power converter provides power to the at least one processing circuit through the PCB;
a first cooling plate arranged adjacent the first side of the PCB, wherein the first cooling plate is operatively coupled to the at least one processing circuit; and
a second cooling plate arranged adjacent the second side of the PCB, wherein the second cooling plate is operatively coupled to the power converter, and wherein the PCB, the at least one processing circuit, and the power converter are sandwiched between the first cooling plate and the second cooling plate.