US 12,245,359 B2
Heatsink techniques for optical and electrical modules
Mitchell O'Leary, Ottawa (CA); Victor Aldea, Ottawa (CA); Kamran Rahmani, Kanata (CA); Trevor Meunier, Kemptville (CA); Peter Ajersch, Ottawa (CA); Terence Graham, Manotick (CA); and Marc Leclair, Gatineau (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Jun. 17, 2024, as Appl. No. 18/745,045.
Application 18/745,045 is a continuation of application No. 17/761,036, previously published as PCT/US2020/049852, filed on Sep. 9, 2020.
Application 17/761,036 is a continuation of application No. 16/571,722, filed on Sep. 16, 2019, granted, now 10,939,536, issued on Mar. 2, 2021.
Prior Publication US 2024/0339767 A1, Oct. 10, 2024
Int. Cl. H05K 1/02 (2006.01); H01L 23/40 (2006.01); H01R 4/30 (2006.01); H01R 4/48 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0203 (2013.01) [H01L 23/40 (2013.01); H01R 4/30 (2013.01); H01R 4/48 (2013.01); H05K 1/021 (2013.01); H05K 1/181 (2013.01); H05K 7/205 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10734 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A module for use in a hardware platform for networking, computing, and/or storage, the module comprising:
a printed circuit board assembly;
components disposed on a primary side of the printed circuit board assembly;
a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module, wherein the primary side heatsink is attached to a faceplate of the module via a sprung line-contact.