US 12,245,019 B2
Signal processing device, method, and program
Hiroyuki Honma, Chiba (JP); Minoru Tsuji, Chiba (JP); and Toru Chinen, Kanagawa (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Filed by Sony Group Corporation, Tokyo (JP)
Filed on Dec. 23, 2022, as Appl. No. 18/088,002.
Application 18/088,002 is a continuation of application No. 17/400,010, filed on Aug. 11, 2021, granted, now 11,805,383.
Application 17/400,010 is a continuation of application No. 16/755,771, granted, now 11,109,179, previously published as PCT/JP2018/037330, filed on Oct. 5, 2018.
Claims priority of application No. 2017-203877 (JP), filed on Oct. 20, 2017.
Prior Publication US 2023/0126927 A1, Apr. 27, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04S 7/00 (2006.01); G10K 15/12 (2006.01); G10L 19/008 (2013.01); H04S 3/00 (2006.01)
CPC H04S 7/305 (2013.01) [G10K 15/12 (2013.01); H04S 3/008 (2013.01); G10L 19/008 (2013.01); H04S 2400/01 (2013.01); H04S 2400/11 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A signal processing device comprising:
processing circuitry configured to:
acquire reverb information including at least one of space reverb information specific to a space around an audio object or object reverb information specific to the audio object and an audio object signal of the audio object;
generate a signal of a reverb component of the audio object on a basis of the reverb information and the audio object signal; and
perform rendering processing of the reverb component of the audio object and the audio object signal to generate an output audio signal.