US 12,244,989 B2
Headphone structure
Nonomi Shiwaku, Tokyo (JP)
Assigned to Audio-Technica Corporation, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Jun. 28, 2022, as Appl. No. 17/851,256.
Claims priority of application No. 2021-112985 (JP), filed on Jul. 7, 2021.
Prior Publication US 2023/0011116 A1, Jan. 12, 2023
Int. Cl. H04R 1/10 (2006.01); H04R 1/02 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 1/025 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A headphone structure comprising:
a driver unit;
a baffle plate that holds the driver unit, has an outer edge and has a plurality of acoustic holes through which a sound generated by the driver unit passes, wherein the acoustic holes exist at respective positions spaced inward from the outer edge, within a region of the baffle plate, and the region having a diameter;
an acoustic member having a first surface and a second surface opposite the first surface, wherein the acoustic member has an annular shape with an inner diameter larger than the diameter of the region of the baffle plate wherein the acoustic holes exist and is disposed on the baffle plate in an arrangement wherein the first surface contacts a surface area of the baffle plate outside the region of the baffle plate wherein the acoustic holes exist and an inner edge of the annular shape surrounds and is outside said region of the baffle plate; and
an ear pad disposed on the second surface of the acoustic member that contacts the baffle plate.