US 12,244,785 B2
State monitoring method and state monitoring system
Yasutaka Serizawa, Tokyo (JP); Hisanori Matsumoto, Tokyo (JP); and Goichi Ono, Tokyo (JP)
Assigned to Hitachi, Ltd., Tokyo (JP)
Filed by Hitachi, Ltd., Tokyo (JP)
Filed on Jul. 5, 2023, as Appl. No. 18/218,261.
Claims priority of application No. 2022-112083 (JP), filed on Jul. 12, 2022.
Prior Publication US 2024/0022701 A1, Jan. 18, 2024
Int. Cl. G06V 20/52 (2022.01); G06T 7/80 (2017.01); H04N 13/296 (2018.01)
CPC H04N 13/296 (2018.05) [G06T 7/85 (2017.01); G06V 20/52 (2022.01); G06T 2207/30232 (2013.01); G06T 2207/30244 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A state monitoring method using a 3D camera configured to acquire an image in a work area and information processing apparatus connected to the 3D camera and including a processing unit and a storage unit, the method comprising:
allowing the processing unit to
calculate a camera setting parameter that determines an imaging condition of the 3D camera with respect to a monitoring target as a target to be monitored in the work area and store the camera setting parameter in the storage unit,
determine the imaging condition of the 3D camera by applying the camera setting parameter corresponding to the monitoring target with reference to the camera setting parameter stored in the storage unit,
acquire an image of the monitoring target from the 3D camera configured to image the monitoring target in the determined imaging condition, and
determine a state of the monitoring target based on the acquired image of the monitoring target.