| CPC H03K 19/0005 (2013.01) [H03K 3/011 (2013.01)] | 15 Claims |

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1. A semiconductor circuit comprising:
a first pad;
a second pad;
an internal circuit configured to receive a first external signal and a second external signal and configured to generate a first internal signal and a second internal signal; and
a swapping circuit configured to, based on master information and swapping information, couple the internal circuit to one of first and second pads to provide a path through which the first internal signal is output and a path through which the first external signal is received, and couple the internal circuit to the other of the first and second pads to provide a path through which the second internal signal is output and a path through which the second external signal is received.
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