US 12,244,307 B2
Semiconductor circuit capable of swapping signal paths and semiconductor apparatus using the same
Hyun Wook Han, Icheon-si Gyeonggi-do (KR); and Min Chang Kim, Icheon-si Gyeonggi-do (KR)
Assigned to SK hynix Inc., Icheon-si Gyeonggi-do (KR)
Filed by SK hynix Inc., Icheon-si Gyeonggi-do (KR)
Filed on Mar. 19, 2024, as Appl. No. 18/609,561.
Application 18/609,561 is a continuation of application No. 17/685,094, filed on Mar. 2, 2022, granted, now 11,967,950.
Claims priority of application No. 10-2021-0100695 (KR), filed on Jul. 30, 2021.
Prior Publication US 2024/0223188 A1, Jul. 4, 2024
Int. Cl. H03K 19/00 (2006.01); H03K 3/011 (2006.01)
CPC H03K 19/0005 (2013.01) [H03K 3/011 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor apparatus comprising:
a first semiconductor chip configured to, based on first chip master information and swapping information, output a first chip end output signal through a first pad, provide a first chip end input signal that is received through the first pad, and provide a first chip start input signal that is received through a second pad; and
a second semiconductor chip configured to, based on second chip master information and the swapping information, output a second chip start output signal through a first pad, output a second chip end output signal through a second pad, and provide a second chip end input signal that is received through the second pad,
wherein the second semiconductor chip is disposed by being rotated 180 degrees with respect to the first semiconductor chip,
wherein the first pad of the first semiconductor chip is coupled to the second pad of the second semiconductor chip, and
wherein the second pad of the first semiconductor chip is coupled to the first pad of the second semiconductor chip.