US 12,244,299 B2
Transversely-excited film bulk acoustic resonator with periodic etched holes
Ventsislav Yantchev, Sofia (BG)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by MURATA MANUFACTURING CO., LTD., Kyoto-fu (JP)
Filed on Jan. 19, 2024, as Appl. No. 18/417,972.
Application 18/417,972 is a continuation of application No. 17/702,549, filed on Mar. 23, 2022, granted, now 11,916,540.
Application 17/702,549 is a continuation of application No. 16/930,534, filed on Jul. 16, 2020, granted, now 11,323,096, issued on Apr. 13, 2022.
Application 16/930,534 is a continuation in part of application No. 16/689,707, filed on Nov. 20, 2019, granted, now 10,917,070, issued on Feb. 9, 2021.
Application 16/689,707 is a continuation of application No. 16/230,443, filed on Dec. 21, 2018, granted, now 10,491,192, issued on Nov. 26, 2019.
Claims priority of provisional application 62/874,709, filed on Jul. 16, 2019.
Claims priority of provisional application 62/753,815, filed on Oct. 31, 2018.
Claims priority of provisional application 62/748,883, filed on Oct. 22, 2018.
Claims priority of provisional application 62/741,702, filed on Oct. 5, 2018.
Claims priority of provisional application 62/701,363, filed on Jul. 20, 2018.
Claims priority of provisional application 62/685,825, filed on Jun. 15, 2018.
Prior Publication US 2024/0186984 A1, Jun. 6, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/56 (2006.01); H03H 9/02 (2006.01); H03H 9/13 (2006.01); H03H 9/17 (2006.01); H03H 3/02 (2006.01); H10N 30/87 (2023.01)
CPC H03H 9/568 (2013.01) [H03H 9/02015 (2013.01); H03H 9/02031 (2013.01); H03H 9/02062 (2013.01); H03H 9/02228 (2013.01); H03H 9/132 (2013.01); H03H 9/174 (2013.01); H03H 9/176 (2013.01); H03H 9/562 (2013.01); H03H 9/564 (2013.01); H03H 3/02 (2013.01); H03H 2003/023 (2013.01); H03H 9/02039 (2013.01); H10N 30/877 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An acoustic resonator, comprising:
a substrate;
a dielectric layer disposed on the substrate and having a cavity disposed therein;
a piezoelectric layer disposed above the dielectric layer and including a diaphragm over the cavity in the dielectric layer;
a conductor pattern at the piezoelectric layer and including an interdigital transducer (IDT) having a plurality of interleaved fingers on the diaphragm; and
at least one hole extending in the diaphragm at an end of at least one finger of the plurality of interleaved fingers of the IDT.