US 12,244,293 B2
Film bulk acoustic resonator filter assembling and interconnecting method and electronic device
Huaiqiang Yu, Chongqing (CN); Lei Zhang, Chongqing (CN); Like Deng, Chongqing (CN); Xi Wang, Chongqing (CN); Bin Cheng, Chongqing (CN); Jinyi Ma, Chongqing (CN); Chuangxin Jiang, Chongqing (CN); Mingyan Jiang, Chongqing (CN); Shiyi Jiang, Chongqing (CN); Meirui Liu, Chongqing (CN); and Xiao Peng, Chongqing (CN)
Assigned to NO. 26 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, Chongqing (CN)
Filed by NO. 26 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, Chongqing (CN)
Filed on Sep. 28, 2022, as Appl. No. 17/955,501.
Application 17/955,501 is a continuation of application No. PCT/CN2022/072462, filed on Jan. 18, 2022.
Prior Publication US 2023/0030644 A1, Feb. 2, 2023
Int. Cl. H03H 9/17 (2006.01); H03H 9/02 (2006.01); H03H 9/54 (2006.01); H03H 9/60 (2006.01)
CPC H03H 9/171 (2013.01) [H03H 9/02952 (2013.01); H03H 9/542 (2013.01); H03H 9/605 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for assembling and interconnecting a film bulk acoustic resonator (FBAR) filter, comprising:
constructing an equivalent circuit model of an assembled FBAR filter according to a circuit model of a filter chip of the FBAR filter and a grounding circuit of the FBAR filter, wherein
the circuit model of the filter chip is simulated by a plurality of film bulk acoustic resonators in different architecture configurations, the grounding circuit of the FBAR filter comprises a parasitic capacitor of a grounding pad on a surface of the filter chip, a parasitic inductor of the grounding pad on the surface of the filter chip and a parasitic inductor of a grounding bond-wire, each grounding circuit of the plurality of film bulk acoustic resonators are of the same structure, and the grounding circuit is formed by connecting the parasitic capacitor and the parasitic inductor of the grounding pad in series and then to be connected in parallel with the parasitic inductor of the grounding bond-wire;
modeling, simulating and calculating the grounding circuit of the FBAR filter to extract parasitic parameters corresponding to the grounding pad and the grounding bond-wire of the grounding circuit, respectively;
feedbacking the parasitic parameters of the grounding circuit into the equivalent circuit model of the assembled FBAR filter and obtaining an S parameter of the FBAR filter by using a circuit simulation software;
adjusting the parasitic parameters of the grounding circuit to optimize an S parameter performance of the FBAR filter, and
obtaining an optimal assembly configuration of the FBAR filter by comparing S parameter performances of the FBAR filter with different assembly configurations to guide an assembly of the FBAR filter.