US 12,244,286 B2
Impedance matching device and high-frequency power supply system
Yuichi Hasegawa, Osaka (JP); and Yuya Ueno, Osaka (JP)
Assigned to DAIHEN CORPORATION, Osaka (JP)
Filed by DAIHEN CORPORATION, Osaka (JP)
Filed on Sep. 6, 2022, as Appl. No. 17/903,467.
Claims priority of application No. 2021-159088 (JP), filed on Sep. 29, 2021.
Prior Publication US 2023/0097183 A1, Mar. 30, 2023
Int. Cl. H03H 7/40 (2006.01); H01J 37/32 (2006.01); H03H 7/38 (2006.01)
CPC H03H 7/40 (2013.01) [H01J 37/32183 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An impedance matching device configured to be disposed between a power supply and a load and perform impedance matching between the power supply and the load, the impedance matching device comprising:
a first power supply configured to generate a first high-frequency voltage having a first fundamental frequency and supply a first high-frequency power to the load;
a detector configured to acquire information about the first high-frequency power;
an impedance information output part configured to calculate an impedance value based on the information acquired by the detector and to convert the calculated impedance value into a reflection coefficient having vector components; and
a matching part configured to perform a matching operation in which an impedance matching between the power supply and the load, based on the vector components of the reflection coefficient supplied from the impedance information output part,
wherein the impedance information output part generates an impedance locus using the impedance value.