US 12,244,126 B2
Systems and methods for transferring heat generated in an electrical enclosure
Erik Ryan Khzouz, Plainville, CT (US)
Assigned to ABB Schweiz AG, Baden (CH)
Filed by ABB Schweiz AG, Baden (CH)
Filed on Apr. 22, 2022, as Appl. No. 17/726,969.
Prior Publication US 2023/0344203 A1, Oct. 26, 2023
Int. Cl. H02B 1/56 (2006.01); H02B 1/20 (2006.01)
CPC H02B 1/565 (2013.01) [H02B 1/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for transferring heat generated by current-conducting electrical components in an electrical enclosure housing a busbar assembly and a circuit breaker, the system comprising:
run-in buses configured to conduct an electrical current between the busbar assembly and the circuit breaker, each pair of adjacent run-in buses being separated by a space;
a thermally conductive plate having at least one opening extending therethrough, wherein the plate receives the run-in buses through the at least one opening, the plate having a face surface facing the run-in buses; and
at least one contact assembly secured to the plate, the at least one contact assembly positioned on the face surface, the at least one contact assembly having spaced apart fingers that partially cover the at least one opening of the plate, wherein adjacent fingers define a slot, each of the fingers being located in the respective space between adjacent run-in buses, and each of the run-in buses being located in the respective slot when the fingers are located in the spaces between adjacent run-in buses, and wherein the run-in buses and contact assembly fingers are oriented in an interleaved pattern.