US 12,244,052 B2
Communication device having a heat sink antenna
Martin R. Pais, North Barrington, IL (US); Md Rashidul Islam, Lombard, IL (US); and Hugh K. Smith, Palatine, IL (US)
Assigned to Motorola Mobility LLC, Chicago, IL (US)
Filed by MOTOROLA MOBILITY LLC, Chicago, IL (US)
Filed on Jun. 26, 2020, as Appl. No. 16/913,408.
Prior Publication US 2021/0408658 A1, Dec. 30, 2021
Int. Cl. H01Q 21/08 (2006.01); H01Q 1/00 (2006.01); H01Q 5/30 (2015.01); H01Q 7/00 (2006.01); H01Q 9/04 (2006.01); H01Q 9/30 (2006.01); H04W 88/06 (2009.01)
CPC H01Q 1/002 (2013.01) [H01Q 5/30 (2015.01); H01Q 7/00 (2013.01); H01Q 9/0421 (2013.01); H01Q 9/30 (2013.01); H04W 88/06 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A communication device comprising:
a first millimeter wave (mmWave) antenna module;
a first heat sink antenna having a first portion in thermal conductive contact with at least a portion of a surface of the first mmWave antenna module and having a second portion extending away from the first mmWave antenna module to transfer thermal energy away from the first mmWave antenna module, the first heat sink antenna configured as a capacitively coupled sub-6 GHz antenna for communication, with a capacitance sensor for human proximity detection; and
a radio frequency (RF) front end comprising a mmWave transmitter that radiates a mmWave signal via the first mmWave antenna module, resulting in generation of the thermal energy, the RF front end further comprising a sub-6 GHz transmitter that radiates a sub-6 GHz signal via the first heat sink antenna.