US 12,243,967 B2
Pixel package and method of making the same
Chi-Chih Pu, Hsinchu (TW); Li-Yuan Huang, Hsinchu (TW); Tzu-Hsiang Wang, Hsinchu (TW); and Ya-Wen Lin, Hsinchu (TW)
Assigned to Epistar Corporation, Hsinchu (TW); and Yenrich Technology Corporation, Hsinchu (TW)
Filed by EPISTAR CORPORATION, Hsinchu (TW); and Yenrich Technology Corporation, Hsinchu (TW)
Filed on Dec. 29, 2021, as Appl. No. 17/565,158.
Prior Publication US 2023/0207742 A1, Jun. 29, 2023
Int. Cl. H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/483 (2013.01) [H01L 25/0753 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A pixel package, comprising:
an electrode structure comprising an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer;
a plurality of light-emitting units each arranged on the electrode structure, and having a first top surface; and
a light transmitting layer having a second top surface located above the first top surface, wherein the electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer,
wherein the upper layer has a total area which is larger than 50% area of the second top surface,
wherein, in a top view, the first upper sheet is overlapped with and larger than the first lower sheet.