| CPC H01L 33/06 (2013.01) [H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/10 (2013.01); H01L 33/20 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01)] | 20 Claims |

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1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED of the multiple micro-LEDs comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer; and
a light emitting layer formed between the first type conductive layer and the second type conductive layer,
wherein the light emitting layer is continuously formed on the whole chip, the multiple micro-LEDs sharing the light emitting layer,
an isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer, and
a top surface of the isolation structure is aligned with a top of the light emitting layer, and a bottom surface of the isolation structure is under the light emitting layer.
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