US 12,243,957 B2
Micro-LED structure and micro-LED chip including same
Qiming Li, Albuquerque, NM (US); Yuankun Zhu, Shanghai (CN); Anle Fang, Shanghai (CN); and Deshuai Liu, Shanghai (CN)
Assigned to JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed by JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed on Dec. 27, 2021, as Appl. No. 17/562,140.
Claims priority of provisional application 63/131,128, filed on Dec. 28, 2020.
Prior Publication US 2022/0209050 A1, Jun. 30, 2022
Int. Cl. H01L 33/06 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/02 (2010.01); H01L 33/04 (2010.01); H01L 33/10 (2010.01); H01L 33/20 (2010.01); H01L 33/24 (2010.01); H01L 33/38 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/36 (2010.01)
CPC H01L 33/06 (2013.01) [H01L 25/0753 (2013.01); H01L 27/15 (2013.01); H01L 27/153 (2013.01); H01L 33/02 (2013.01); H01L 33/04 (2013.01); H01L 33/10 (2013.01); H01L 33/20 (2013.01); H01L 33/24 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A micro-LED chip including multiple micro-LEDs, wherein,
at least one micro-LED of the multiple micro-LEDs comprises:
a first type conductive layer;
a second type conductive layer stacked on the first type conductive layer;
a light emitting layer formed between the first type conductive layer and the second type conductive layer;
a top spacer formed between the light emitting layer and the second type conductive layer; and
a bottom spacer formed between the light emitting layer and the first type conductive layer,
wherein the light emitting layer, the top spacer, and the bottom spacer are continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer, the top spacer, and the bottom spacer,
an isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer, and
a top surface of the isolation structure is above the light emitting layer, and a bottom surface of the isolation structure is under the light emitting layer.