US 12,243,955 B2
Display and micro device array for transfer to a display substrate
Andreas Bibl, Los Altos, CA (US); John A. Higginson, Santa Clara, CA (US); Hung-Fai Stephen Law, Los Altos, CA (US); and Hsin-Hua Hu, Los Altos, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Apr. 30, 2019, as Appl. No. 16/399,853.
Application 16/399,853 is a continuation of application No. 14/312,554, filed on Jun. 23, 2014, granted, now 10,297,712.
Application 14/312,554 is a continuation of application No. 13/372,258, filed on Feb. 13, 2012, granted, now 8,794,501, issued on Aug. 5, 2014.
Claims priority of provisional application 61/594,919, filed on Feb. 3, 2012.
Claims priority of provisional application 61/561,706, filed on Nov. 18, 2011.
Prior Publication US 2019/0259907 A1, Aug. 22, 2019
Int. Cl. H01L 33/06 (2010.01); F21V 7/00 (2006.01); H01L 27/15 (2006.01); H01L 29/06 (2006.01); H01L 33/00 (2010.01); H01L 33/04 (2010.01); H01L 33/28 (2010.01); H01L 33/30 (2010.01); H01L 25/075 (2006.01); H01L 33/20 (2010.01)
CPC H01L 33/06 (2013.01) [F21V 7/00 (2013.01); H01L 27/15 (2013.01); H01L 29/0684 (2013.01); H01L 33/0093 (2020.05); H01L 33/04 (2013.01); H01L 33/28 (2013.01); H01L 33/30 (2013.01); H01L 25/0753 (2013.01); H01L 33/20 (2013.01); H01L 2224/95 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A structure comprising:
a substrate layer;
an array of posts protruding from the substrate layer;
a continuous bonding layer comprising a metal or metal alloy on the array of posts and the substrate; and
a corresponding array of laterally separate micro devices on the bonding layer on top of the array of posts, wherein each micro device includes a bottom surface that is wider than a corresponding post top surface directly underneath the micro device.