US 12,243,954 B2
Method for manufacturing light-emitting element
Yoshiki Inoue, Anan (JP); Shun Kitahama, Tokushima (JP); Yoshiyuki Aihara, Tokushima (JP); Yoshiki Matsushita, Tokushima (JP); and Keisuke Higashitani, Tokushima (JP)
Assigned to Nichia Corporation, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Jun. 28, 2023, as Appl. No. 18/343,078.
Application 18/343,078 is a division of application No. 17/113,583, filed on Dec. 7, 2020, granted, now 11,735,686.
Claims priority of application No. 2019-231153 (JP), filed on Dec. 23, 2019.
Prior Publication US 2023/0343892 A1, Oct. 26, 2023
Int. Cl. H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/50 (2010.01)
CPC H01L 33/0095 (2013.01) [H01L 33/007 (2013.01); H01L 33/22 (2013.01); H01L 33/507 (2013.01); H01L 2933/0041 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for manufacturing a light-emitting element, the method comprising:
forming a semiconductor structure comprising a light-emitting layer on a first surface of a substrate, wherein the first surface comprising a first region and a second region, the first region comprises a plurality of protrusions, and an arithmetic average roughness of a surface of the second region is smaller than an arithmetic average roughness of a surface of the first region;
dividing the semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region of the substrate, wherein the second region is exposed from the semiconductor structure in the exposed region;
bonding a light-transmitting body to a second surface of the substrate that is opposite the first surface so as to form a bonded body, wherein the light-transmitting body comprises a fluorescer;
after the bonding of the light-transmitting body to the second surface, forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from a first surface side;
after the forming of the plurality of modified regions, removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and
singulating the bonded body along the modified regions.