US 12,243,944 B2
Solid-state image pickup unit and electronic apparatus
Tetsuji Yamaguchi, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Oct. 24, 2023, as Appl. No. 18/493,130.
Application 18/493,130 is a continuation of application No. 17/747,268, filed on May 18, 2022, granted, now 11,855,227.
Application 17/747,268 is a continuation of application No. 17/068,807, filed on Oct. 12, 2020, granted, now 11,367,794, issued on Jun. 21, 2022.
Application 17/068,807 is a continuation of application No. 16/056,139, filed on Aug. 6, 2018, granted, now 10,833,110, issued on Nov. 10, 2020.
Application 16/056,139 is a continuation of application No. 15/581,317, filed on Apr. 28, 2017, granted, now 10,074,697, issued on Sep. 11, 2018.
Application 15/581,317 is a continuation of application No. 15/581,128, filed on Apr. 28, 2017, granted, now 10,008,524, issued on Jun. 26, 2018.
Application 15/581,128 is a continuation of application No. 14/759,734, granted, now 9,954,018, issued on Apr. 24, 2018, previously published as PCT/JP2013/084053, filed on Dec. 19, 2013.
Claims priority of application No. 2013-005274 (JP), filed on Jan. 16, 2013.
Prior Publication US 2024/0055534 A1, Feb. 15, 2024
Int. Cl. H01L 27/146 (2006.01); H01L 29/16 (2006.01); H01L 29/24 (2006.01); H01L 29/786 (2006.01); H04N 25/13 (2023.01); H04N 25/63 (2023.01); H04N 25/70 (2023.01); H04N 25/76 (2023.01); H10K 19/20 (2023.01); H10K 39/32 (2023.01)
CPC H01L 29/7869 (2013.01) [H01L 27/14603 (2013.01); H01L 27/14609 (2013.01); H01L 27/14612 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14665 (2013.01); H01L 29/16 (2013.01); H01L 29/24 (2013.01); H04N 25/134 (2023.01); H04N 25/63 (2023.01); H04N 25/70 (2023.01); H04N 25/76 (2023.01); H10K 19/20 (2023.02); H10K 39/32 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A light detecting device, comprising:
a photoelectric conversion portion comprising:
a first electrode;
a second electrode; and
a photoelectric conversion layer disposed between the first electrode and the second electrode;
a semiconductor layer;
a semiconductor substrate disposed between the photoelectric conversion portion and the semiconductor layer; and
a wiring layer, wherein the wiring layer includes the semiconductor layer,
wherein one of the first electrode or the second electrode is electrically connected to the semiconductor layer, and
wherein the semiconductor layer comprises a first element and the semiconductor substrate comprises a second element which is different than the first element.